A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design

Michael Opoku Agyeman, Quoc-Tuan Vien, Ali Ahmadinia, Alex Yakovlev, Kin-Fai Tong, Terrence Mak

Research output: Contribution to journalArticleResearchpeer-review

Abstract

Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20.9% and 133.3% compared to existing WiNoCs and wireline NoCs, respectively.
Original languageEnglish
JournalIEEE Transactions on Parallel and Distributed Systems
Early online date2 Jun 2016
DOIs
Publication statusE-pub ahead of print - 2 Jun 2016

Fingerprint

Waveguides
Surface waves
Communication
Millimeter waves
Frequency bands
Scalability
Transducers
Wireless networks
Energy dissipation
Network-on-chip
Bandwidth
Radiation
Degradation
Metals
Costs

Keywords

  • Hybrid wired-wireless
  • Network-on-Chip
  • reliability
  • surface wave
  • mm-Wave
  • WiNoC
  • waveguide
  • wireless channel

Cite this

@article{640661eccbc9404a83972e9c8f52e30c,
title = "A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design",
abstract = "Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20.9{\%} and 133.3{\%} compared to existing WiNoCs and wireline NoCs, respectively.",
keywords = "Hybrid wired-wireless, Network-on-Chip, reliability, surface wave, mm-Wave, WiNoC, waveguide, wireless channel",
author = "{Opoku Agyeman}, Michael and Quoc-Tuan Vien and Ali Ahmadinia and Alex Yakovlev and Kin-Fai Tong and Terrence Mak",
year = "2016",
month = "6",
day = "2",
doi = "10.1109/TPDS.2016.2575836",
language = "English",
journal = "IEEE Transactions on Parallel and Distributed Systems",
issn = "1045-9219",
publisher = "Institute of Electrical and Electronics Engineers",

}

A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design. / Opoku Agyeman, Michael; Vien, Quoc-Tuan; Ahmadinia, Ali; Yakovlev, Alex; Tong, Kin-Fai; Mak, Terrence.

In: IEEE Transactions on Parallel and Distributed Systems, 02.06.2016.

Research output: Contribution to journalArticleResearchpeer-review

TY - JOUR

T1 - A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design

AU - Opoku Agyeman, Michael

AU - Vien, Quoc-Tuan

AU - Ahmadinia, Ali

AU - Yakovlev, Alex

AU - Tong, Kin-Fai

AU - Mak, Terrence

PY - 2016/6/2

Y1 - 2016/6/2

N2 - Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20.9% and 133.3% compared to existing WiNoCs and wireline NoCs, respectively.

AB - Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20.9% and 133.3% compared to existing WiNoCs and wireline NoCs, respectively.

KW - Hybrid wired-wireless

KW - Network-on-Chip

KW - reliability

KW - surface wave

KW - mm-Wave

KW - WiNoC

KW - waveguide

KW - wireless channel

U2 - 10.1109/TPDS.2016.2575836

DO - 10.1109/TPDS.2016.2575836

M3 - Article

JO - IEEE Transactions on Parallel and Distributed Systems

JF - IEEE Transactions on Parallel and Distributed Systems

SN - 1045-9219

ER -