Keyphrases
Microstructure
100%
Fatigue Behavior
100%
Lead-free Solder Joints
100%
Thermal Fatigue
100%
Isothermal Fatigue
100%
Solder Alloys
75%
Soldering
50%
Stress-life Curve
50%
Sn-37Pb
50%
Mechanical Fatigue
50%
Loading Conditions
25%
Electrical Connection
25%
Room Temperature
25%
Temperature Variation
25%
Fatigue Testing
25%
Solder Joint
25%
Fatigue State
25%
Lead-free
25%
Material Characterization
25%
Mechanical Integrity
25%
Thermal Cycling
25%
Thermal Connection
25%
Mechanical Cycling
25%
In-phase and Out-of-phase
25%
Material Fatigue
25%
Cycling Test
25%
Mechanical Fatigue Test
25%
Fatigue Performance
25%
Surface Mount Device
25%
Microelectronics Industry
25%
Load Control
25%
Ball Grid Array
25%
Engineering
Joints (Structural Components)
100%
Fatigue Behavior
100%
Isothermal
100%
Free Solder
100%
Life Curve
50%
Test Condition
25%
Room Temperature
25%
Microelectronics
25%
Fatigue Testing
25%
Fatigue Performance
25%
Mechanical Fatigue Test
25%
Ball Grid Arrays
25%
Loading Condition
25%
Load Control
25%
Material Science
Fatigue Behavior
100%
Lead-Free Solder
100%
Solder Joint
100%
Surface (Surface Science)
50%